Australia Bond University 2025 Global Alumni Scholarship for Postgraduate Students: (Deadline 13 June 2025)

Australia Bond University 2025 Global Alumni Scholarship for Postgraduate Students: (Deadline 13 June 2025)

Embark on an international journey with the Bond University Global Alumni Scholarship

Do you want to explore the globe while furthering your study at another world-class institution?

The Bond University Global Alumni Scholarships support exceptional graduates who aspire to pursue postgraduate studies at prestigious institutions outside Australia.

Past recipients have attended the likes of Columbia University, University of Cambridge, Harvard University, Tsinghua University and University of Oxford.

The Global Alumni Scholarships are made possible thanks to the incredible donations from our alumni and community to the Ambition Appeal which enables us to provide financial assistance for your ambitious journey. We believe in your potential to make a difference and become leaders in your fields.

About Bond University

The Bond University is a private not-for-profit university located in Robina, Gold Coast, Queensland, Australia. The University was established at the initiative of Alan Bond, the founder and Chairman of Bond Corporation and Harunori Takahashi, President of EIE International. The University’s development was funded via a joint venture between Bond Corporation in Australia and the Japanese entity, EIE International. In 1987, the Parliament of Queensland granted Bond University university status via the passage of the Bond University Act. The University commenced teaching in May 1989

Global Alumni Scholarship

Aim and Benefits of Global Alumni Scholarship

Scholarships up to the value of $10,000 are available in 2025.  The scholarship amount can be utilised for tuition fees, travel and accommodation costs directly related to undertaking the study program.

Requirements for Global Alumni Scholarship Qualification

The following requirements must be met in order to be deemed eligible for the Global Alumni Scholarship:

• Applicants must undertake a full award program at a postgraduate level and must have a valid offer to commence the course prior to applying for the scholarship.
• The scholarship is not intended to support professional development related to employment, including specialised short courses, management training, or non-award professional programs.
• Applicants currently enrolled in an overseas institution with at least half of their degree remaining are also eligible to apply.
• Applicants should either demonstrate current engagement with Bond University or express a strong desire for future opportunities with the institution.

Interview date, Process and Venue for Global Alumni Scholarship

To be awarded the Global Alumni Scholarship, applicants must be a graduate of Bond University.  Australian and international undergraduate and postgraduate alumni are all eligible. Key factors considered include:

• Personal academic merit
• Demonstrated and / or potential leadership
• Citizenship and community service
• Demonstrated commitment to study
• Referee statements outlining the applicant’s abilities
• Academic excellence and/or international prominence of the nominated institution

Documents Required for Application

You will need the following information to complete your application:

• Personal contact details.
• CV/Resume.
• Statement of Application (250–500 words max), addressing your eligibility based on the selection criteria. Please include details such as the benefits you expect to gain if awarded the scholarship, your reasons for choosing the nominated institution and study program, and the outcomes you foresee as a result.
• At least one professional referee must be provided to support this application.
• Education details including transcripts (other than Bond).
• Evidence of acceptance (e.g. letter of offer/enrolment/acceptance) from you nominated institution.
• Applicants are required to provide key financial details:
  i.    Salary/income
  ii.    Cost of the program
  iii.    Other financial support being received

Application Deadline

June 13, 2025

How to Apply

Interested and qualified? Go to Bond University on secureau.imodules.com to apply

CLICK HERE TO READ MORE AND APPLY