BIND Open Innovation & Acceleration Program 2024: (Deadline 6 September, 2024)

Applications are open for the BIND Open Innovation & Acceleration Program 2024. The BIND Open Innovation and Acceleration Program connects dynamic startup teams with well-established companies, to provide external solutions for their internal digital transformation challenges while promoting the development of commercial skills and encouraging the immersion of startups in the local ecosystem, catalyzing new business opportunities.

This zero-equity approach to investing and active acceleration allows startups to maintain ownership and get reference customers while earning paid contracts for implementing solutions in real environments. Ready to work with paying clients on real use cases with the companies driving the Intelligent Industry, Clean Energy & Sustainability, Health and Food sectors? Apply now!

Benefits

• POC, Market Validation
• Access to 70 Corporate Clients
• Startup Acceleration
• 43K Average Contract
• Introductions to Industry Investors
• High Impact Mentoring
• Cross-Vertical Network Immersion
• Retain Ownership, No Equity Taken
• Key Business Workshops

Eligibility

• The disruptive technologies of interest expand each year to meet the needs of the 70+ Corporate Clients from the sectors of Intelligent Industry, Clean Energy & Sustainability, Health Tech and Food Tech in the Basque region. If you have developed any related solutions, they encourage you to apply to put your innovation into action.
• Apply today, if you have developed any technologies listed below:
  • Connectivity and IoT: Smart sensors, Geolocation & Traceability.
  • Artificial Intelligence: Artificial Vision, Machine Learning, Adaptative AI, NLP, IDPs.
  • Immersive Technologies: Augmented Reality, Mixed Reality, Virtual Reality, Digital Twin.
  • Big Data: Advanced Analytics, Advanced Graphics Representation.
  • Software: Content Management Platforms, Document Management Systems.
  • Computing: Edge and Quantum Computing, Cloud Solutions, Virtual and Physical Servers.
  • Additive Manufacturing: Metallic, Plastic and Food Additive Manufacturing.
  • Cybersecurity: Digital Immune Systems, Securitization of Industrial assets.
  • Robotics and Electronics: Collaborative Robotics, Exoskeletons, Power electronics, Nanotechnology.
  • Sustainability & Circular economy: Recycling, Smart Grids and Cleantech.
  • Hydrogen Technologies.
  • Health Tech: Medical devices, Biobased solutions.
  • Food Tech.

Deadline: 6 September, 2024

Application

Click here to apply

For more information, visit BIND Open Innovation & Acceleration Program.