Google 2023 Hardware Engineering Internship Program: (Deadline Ongoing)

Google 2023 Hardware Engineering Internship Program: (Deadline Ongoing)

As a Hardware Engineering Intern, you will work on our core Consumer Hardware products. The teams you work with design, develop, and deploy next generation consumer hardware while ensuring that this cutting-edge equipment is reliable. You’ll work closely with engineers to improve our hardware to meet Google’s standards of quality and reliability, and your work has the potential to impact many of Google users. Depending on your background and experience, you will receive a project placement in ASIC Hardware/Software Engineering, Electrical Hardware Engineering, Hardware Test Engineering, or Silicon Engineering.

About Google

Google LLC is an American multinational technology company that specializes in Internet-related services and products, which include online advertising technologies, search engine, cloud computing, software, and hardware. It is considered one of the Big Four technology companies, alongside Amazon, Apple, and Facebook. Google was founded in September 1998 by Larry Page and Sergey Brin while they were Ph.D. students at Stanford University in California. The company’s rapid growth since incorporation has triggered a chain of products, acquisitions, and partnerships beyond Google’s core.

Hardware Engineering Internship Program

• Type Internship
• Organisation Google
• Country to study United States
• School to study–
• Course to study Not specified
• State of Origin
• Gender Men and Women
• Application Deadline Not Specified

Aim and Benefits of Hardware Engineering Internship Program

Minimum full-time salary of $89,500 for this role when being hired into our offices in Colorado

Requirements for Hardware Engineering Internship Program Qualification

Minimum qualifications:

• Currently pursuing a degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Experience in one or more of the following areas: Hardware System Integration, Signal and Power Integrity, RF System Validation, Bluetooth, Wireless Communications, Product Design, Test, Computer Architecture, Microarchitecture, Digital Design Verification, Digital Circuits, ASIC Physical Design, Electronic Design Automation, FPGAs, Embedded Systems, Compilers, Hardware/Software Co-design, Emulation, Memory Systems, Design methodology.

Preferred qualifications:

• Currently attending a degree program in the US with plans to return to the degree program after completion of the internship.
• Experience working on consumer hardware projects.
• Experience with wireless communication interfaces and sensors
• Experience with board layout (e.g., working with CAD/PCB design), Systems Integration, RF, Hardware Test, or Antenna.
• Available to work full time for a minimum of 12 weeks outside of university term time.

Application Deadline

Not Specified

How to Apply

Applications will go live in late Fall 2022. Please set up an alert to get notified when the role goes live via google.com/students.

Participation in the internship program requires that you are located in the United States for the duration of the internship program.

This internship is intended for students who are pursuing a degree with an anticipated graduation date on or before June 2024, depending on their program and unique circumstances.

To start the application process, you will need an updated CV or resume and a current unofficial or official transcript in English. Click on the “Apply” button on this page and provide the required materials in the appropriate sections (PDFs preferred):

1. In the “Resume Section:” attach an updated CV or resume.
   • Please ensure you’ve listed your anticipated graduation date (in MM/YY) and any proficiency in statistical software and database languages on the resume, along with any technical experience or projects.
2. In the “Education Section:” attach a current or recent unofficial or official transcript in English.
   • Under “Degree Status,” select “Now attending” to upload a transcript.

For more details, visit Google website.

CLICK HERE TO READ MORE AND APPLY