US 2024 South Pacific Scholarship Program: (Deadline 15 January, 2024)

US 2024 South Pacific Scholarship Program: (Deadline 15 January, 2024)

US 2024 South Pacific Scholarship Program: (Deadline 15 January, 2024)

The U.S. South Pacific Scholarship Program (USSP), authorized by the U.S. Congress and funded by the Bureau of Educational and Cultural Affairs of the U.S. Department of State, is a competitive, merit-based scholarship program that provides opportunities for Master’s and Bachelor’s degree study at the University of Hawai‘i in fields that are directly relevant to the development needs of Pacific island countries.

About East-West Center

Established by the US Congress in 1960, the Center serves as a resource for information and analysis on critical issues of common concern, bringing people together to exchange views, build expertise, and develop policy options. The Center is an independent, public, nonprofit organization with funding from the US government, and additional support provided by private agencies, individuals, foundations, corporations, and governments in the region.

  • Undergraduate South Pacific Scholarship Program
  • Masters South Pacific Scholarship Program

Interview date, Process and Venue for US Undergraduate South Pacific Scholarship Program

Selection

Selection will be made, with input from U.S. Embassies in the region, by a U.S.-based academic review committee that may include Pacific Islands and other specialists from the East-West Center and University of Hawai‘i system, a representative of the Bureau of Educational and Cultural Affairs, and a Pacific Islands student representative.

Documents Required for Application

Application Materials

Application Deadline

January 15, 2024

US Masters South Pacific Scholarship Program

  • Type Masters
  • Organisation East-West Center
  • Country to study United States
  • School to study
  • Course to study Not specified
  • State of Origin
  • Gender Men and Women
  • Application Deadline 15 January, 2024

Aim and Benefits of US Masters South Pacific Scholarship Program

Scholarship covers full tuition fee

Requirements for US Masters South Pacific Scholarship Program Qualification

  • Applicants must have completed at least a three-year baccalaureate program.  Those with a three-year Bachelor’s degree may apply for a bridging program of up to one year, which upon completion allows for application to a master’s degree program.  Master’s programs may not require a bridging component, depending on prior study and academic performance during the first year.  The USSP program does not generally permit direct application and admission to a graduate degree program.  Those who possess both a bachelor’s degree and a post-graduate diploma or honors degree, or will have earned a post-graduate diploma or honors degree before the scholarship’s August start date, are strongly encouraged to apply.
  • Because an objective of the program is to provide an educational exchange experience to those not previously afforded such an opportunity, preference will usually be given to candidates who have not had recent extensive experience in the United States.  Preference may also be given to candidates who have not had extensive opportunities for study at educational institutions outside the Pacific Islands region.
  • Note:  Individuals who have dual citizenship, one being that of the United States, are not eligible.  U.S. non-citizen nationals and U.S. permanent residents are also not eligible for USSP.  All scholarship recipients must be able to meet the requirements of the Exchange Visitor (J-1 visa) program.

Interview date, Process and Venue for US Masters South Pacific Scholarship Program

Selection

Selection will be made, with input from U.S. Embassies in the region, by a U.S.-based academic review committee that may include Pacific Islands and other specialists from the East-West Center and University of Hawai‘i system, a representative of the Bureau of Educational and Cultural Affairs, and a Pacific Islands student representative.

Documents Required for Application

Application Materials

Application Deadline

January 15, 2024

How to Apply

For more details, visit visit Official link & Apply





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